Our technologies

Here is a summary of our know-how and available technologies :

Prototypes

As far as your design allows, all our PCBs can be delivered in accordance with class 1, 2 or 3 of the IPC-6010. The analysis laboratories of our factories have been sized to perform all the tests required by class 3 of the IPC-6012.

For your projects, our prototype department can supply :

Technology	Minimum lead time (working days)
From double sided till standard technology multilayer	3 days
HDI Multilayers. with single build up microvias with double build up microvias (1 subset) with triple build up microvias (2 subsets) with quadruple build up microvias (3 subsets)	5 days 8 days 11 days 14 days
Flexi-rigid. with 1 simple pressing with 1 subset or 2 subsets back to back with 2 subsets	8 days 12 days 16 days

Add 1 day for IPC-6010 class 3 products (controls).

From double sided to multilayers

We manufacture small and medium size batches within 2 to 4 weeks, with both standard and advanced technologies, including critical signals and high frequency applications :

Technologies availables :
- Rigids : IPC 6012 types 1 to 6
- Flexibles et Flexi-rigids : IPC 6013 types 1 to 4
- HF Circuits : IPC 6018 types 1 to 6
- Advanced technologies :
  - Controlled impedance,
  - Controlled expansion,
  - Internal or external drain,
  - Via filled with resin,
  - Microvias full-copper and stacked,
  - Back-drilling,
  - Inground components.
Advanced technologies :
- High Tg epoxy resins (IPC-4101/98, 99 and 126),
- Poly-imide, BT and Cyanate Ester Resins (IPC-4101/30, 40, 41 and 71),
- PTFE resins (IC-4103/01, 02, 05, 06, 09 and 16),
- Polyimide, BT and Cyanate Ester Resins (IC-4103/10 and 11),
- Polyimide film with or without adhesive (IPC-4204/1 and 11),
- Copper-Invar-Copper,
- Carbon Fabrics (Stablcor®),
- And hybrid constructions.
Finitions :
- Leaded HASL,
- Nickel Gold Chemical (ENIG),
- Electrolytic Gold Nickel (Hard Gold),
- And HASL RoHS, ENEPIG, OSP, Soft Gold, Chemical tin and Chemical silver (subcontracted).
Slices and shields on the slices to multiply the critical signals on the same circuit.

Our mastery of the most advanced technologies allows us to offer reliable and proven solutions to use the most demanding boxes (Micro BGA, QFN, CSP et COB ...) :

Multi-sequential constructions (blind holes and buried holes).
Multi-Sequential Stacked Microvias Constructions Up to the LSIC.
Tracks and isolations of 50/50 μm locally and 75/90 μm as standard.
Metallization of holes up to 20: 1.

This allows us to offer products combining high technology and high reliability…

Volumes

For larger volumes, we propose to carry out your circuits in our factory based in CHINA.

The transmission of data can thus be done from one site to another without loss of information and while keeping a European interlocutor.

Thus, we can meet the same types of demand for rigid or flexi-rigid printed circuits at far-east prices!